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High Performance Compressible Non - Silicone Thermal Pad 2.65 G/Cc 1mm

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High Performance Compressible Non - Silicone Thermal Pad 2.65 G/Cc 1mm

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Brand Name : ZIITEK

Model Number : Zpaster140-20-11F

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 days

Packaging Details : 1000pcs/bag

Color : Dark grey

Thermal conductivity : 2 W/mK

Product name : Zpaster140-20-11F

Specific Gravity : 2.65 g/cc

Dielectric Constant : 5.5 MHz

Outgassing (TML) : 0.30%

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No silicone material thermal gap pad Zpaster140-20-11F 2w silicone-free thermal pad 2.65 g/cc 1mmT for battery

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Zpaster140-20-11F is a high performance and compatible non-silicone material of the thermal conductive interface materials.The role is to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.

It applies to the liner based on silicone suitably. The flexibility and elasticity make it suited to the coating of the very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

Features

>Silicone-free

>ROSH compliance

>Good thermal conductive:2.0 W/mK

>Soft and Compressible for low stress applications

>Available in varies thickness

Application

>Car Battery & Power Supply

>Charging Pile

>Silicone-sensitive applications

>Graphics Card Thermal Module

>Set Top Box

> Medical devices

>LED Lighting

>SFP optical module

Typical Properties of Z-Paster140-20-11F Series
Color Dark grey Visual Dielectric Breakdown Voltage (T= 1mm above) >5000 VAC ASTM D149
Construction Silicone-free The metal oxide fills ********** Dielectric Constant 5.5 MHz ASTM D150
Thermal Conductivity 2.0 W/mK ASTM D5470 Volume Resistivity 6.0X1013 Ohm-meter ASTM D257
Hardness 65 Shore 00 ASTM 2240 Continuous Use Temp – 20 To 125 **********
Specific Gravity 2.65 g/cc ASTM D297 Outgassing (TML) 0.30% ASTM E595
Thickness range 0.010"-0.200" (0.25mm-5.0mm) ASTM D374 Flame Rating 94 V0 equivalent to

Standard size

0.010-inch to 0.200-inch (0.25mm to 5.0mm)

Options

Proprietary NS1 option available to eliminate tack from one side to aid in handling.

High Performance Compressible Non - Silicone Thermal Pad 2.65 G/Cc 1mm

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

4.兆科文化

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.


Product Tags:

silicone thermal pad

      

thermally conductive gap filler

      
Quality High Performance Compressible Non - Silicone Thermal Pad 2.65 G/Cc 1mm wholesale

High Performance Compressible Non - Silicone Thermal Pad 2.65 G/Cc 1mm Images

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